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Glue filling method

Categories: Technical supportStars: 3Stars Visit: - Release time: 2015-06-10 10:00:00
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Glue challenge once decided to use rubber filling method (yi), you must consider a series of challenges, with the implementation of effective process, glue obtain reliable results in a row, while maintaining the required production levels. These key key problems include: to get a complete and no empty chip at the bottom of the plastic flow distribution around the tight packing of chip plastic to avoid contamination of other components through radio frequency (rf) shells or cover opening glue control flux residues. Get a complete and no empty plastic flow for filler material must (capillaryaction) by capillary action suction at the bottom of the chip, so the trick is to get the needle mouth enough near the location of the chip, to start the flow of the gel. Must be careful to avoid touching chips or pollution (die) on the back of the chip. The principle of a recommendation is to needle mouth starting point positioning in needle mouth diameter plus 0.007 quot; The height of the displacement on the x, y, and z as substrate chip (chip), a high degree of 80%. In the process of the glue, also requires accuracy control in order to maintain the flow of glue, and avoid injury and the chip.